ASTM F1269-06Standard Test Methods for Destructive Shear Testing of Ball Bonds
These test methods cover tests to determine the shear strength of a series of ball bonds made by either thermosonic or thermal compression techniques using either gold or copper wires.
These test methods are appropriate for on-line use in process control, for process development, for purchase specifications, and for research in support of improved yield and reliability. Since the ball shearing method tests only the first bond in a microelectronic wire bond interconnection system, it must be used in a complementary fashion with the wire bond pull test.
These test methods cover ball bonds made with small diameter (from 18 to 76-μm (0.0007 to 0.003-in.)) gold or copper wire of the type used in integrated circuits and hybrid microelectronic assemblies, system on a chip, and so forth.
These test methods can be used only when the ball height and diameter are large enough and adjacent interfering structures are far enough away to allow suitable placement and clearance (above the bonding pad and between adjacent bonds) of the shear test ram.
These test methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.